Electronic Grade Polymers Ideal for Today’s Challenging Lithographic Applications
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.
Our synthetic and isolation expertise enables Electronic Polymers to create a wide range of polymers that are ideal for today’s challenging lithographic applications, from Acetoxystyrene Monomer (ASM) to High Compositional Uniformity (HCU) polymers.
ASM
Acetoxystyrene monomer (ASM) is the basic monomer for generation of DuPont electronic grade polymers. Used either in combination with other reactive monomers or used as the sole component for homopolymer generation, ASM is a high purity reactive monomer which readily undergoes free radical polymerization and enables the production of poly(p-acetoxy)styrene (PAS) polymers in a wide range of molecular weights. We exercise great care and effort to maintain the highest possible quality of this key material.
Co- and Ter-Polymers via Custom Manufacture
DuPont has developed a deep expertise in free radical polymerization chemistry. Custom produced resins made from a wide variety of monomers, in combination with ASM, address the growing needs for transparency, polydispersity, acid diffusion characteristics, dissolution rate, Tg, and other factors essential to the performance of photoresists used in critical layers of semiconductor device manufacture.
Lithography Materials and Services
-
Electronic Grade Polymers | DuPont Electronic Solutions
Electronic Grade Polymers | DuPont Electronic Solutions
DUV and 193nm photoresist performance begins with the polymer, and DuPont electronic grade polymers continue to improve upon existing techniques for polymer manufacture, isolation, and evaluation.
-
Advanced Overcoats
Advanced Overcoats
Used in conjunction with photoresists, DuPont’s advanced overcoat materials are designed to prevent defects and improve the lithography process window, enabling finer feature patterns.
-
Anti-Reflectants & Functional Sublayers
Anti-Reflectants & Functional Sublayers
Anti-reflective coatings and sublayers boost the effectiveness of lithography by widening and improving the process and reflectivity windows.
An organic gap filling material for extremely narrow trenchesA family of cross-linkable BARCs that can etch 30% faster than photoresistsAR™ 10L is an organic, thermally cross-linking bottom anti-reflectant coating (BARC) for 248 nm (KrF) photoresists. It is designed to provide a universal anti-reflective surface for high- and low-temperature resist platforms and offers excellent compatibility with most ESCAP HYBRID and Acetal resists.AR™ 137 is an organic bottom anti-reflectant coating (oBARC) for immersion lithography. It is designed to provide excellent optical parameters to minimize reflection through angles for hyper numerical aperture (NA) immersion exposure.AR™ 254 is an organic, thermally cross-linking bottom anti-reflectant for 248 nm (KrF) photoresist. It has excellent gap filling and planarizing properties that are key requirements for advanced semiconductor devices having FinFET structures. AR™ 254 has a high etch rate to reduce substrate damage and optimal optical parameters to minimize reflectance. -
Ancillary Lithography Materials
Ancillary Lithography Materials
DuPont’s roots run deep in its production-proven line of ancillary lithography products. From developers, removers, and other enhancement chemistries, we support a total lithography solution.
-
Photoresists
Photoresists
DuPont’s robust, production-proven photoresist product line offers materials options that meet the requirements across generations of lithography processes.
-
Metrology & Imaging Services
Metrology & Imaging Services
We offer services such as defect testing or patterning wafers
We’re here to help.
We love to talk about how our electronics solutions can build business, commercialize products,
and solve the challenges of our time.