Production-proven Electroplating Chemistries for Wafer Level Packaging
DuPont Electronics and Industrial award-winning SOLDERON™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping fine-pitch Cu µpillars.
Our lead-free, single-step plating materials are specifically designed for the most challenging advanced wafer-level packaging applications. A variety of formulations including tin-silver alloys, pure tin, and indium materials meet a range of process temperatures and melting points, suiting both high- and low-temperature processing needs. Designed to overcome our customers’ most difficult challenges, such as voiding and throughput, SOLDERON™ products feature:
- High-speed plating capabilities
- Good surface morphology
- Excellent thickness uniformity
- A wide process window
DuPont Electronics & Industrial leads the way with low-alpha materials by offering tin with low-alpha-particle-emitting versions of our products, which are ideal for packaging applications sensitive to the effects of these emissions.
- SOLDERON™ BP 1000 Indium Chemistry
- SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry
- SOLDERON™ BP TS 7000 Tin-Silver Plating Chemistry
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What is Solder Bumping?
Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
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Designed for Lead-free Bumping, Capping
Solder bumps form the electronic interconnect between a chip and its substrate. In wafer level packaging processes, bumps range in size and shape from standard C4 bumps, to solder caps on Cu pillars and µpillars.
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Our Semiconductor Packaging Portfolio
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
Semiconductor Packaging Materials
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Solder Bump Plating
Solder Bump Plating
DuPont’s award-winning Solderon™ BP electroplating chemistries are a reliable alternative to tin-lead alloys for all wafer bumping applications.
Solderon™ BP IN 1000 indium plating chemistry is designed for solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature. Its use minimizes substrate warpage and stress, and reduces the possibility of damaging materials in delicate devices due to significantly reduced reflow temperature. -
Copper Pillar Plating
Copper Pillar Plating
Our production-proven Cu pillar formulations work in perfect harmony with our under-bump metallization (UBM) and tin-silver capping chemistries, to provide a seamless solution for all your Cu pillar needs.
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Copper Redistribution Layer
Copper Redistribution Layer
DuPont Electronics & Imaging copper chemistries for redistribution layers (RDLs) are ideally suited to today’s high-density requirements for wafer level packaging applications.
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Under Bump Metallization
Under Bump Metallization
We offer a production-proven electroplating nickel chemistry tailored to meet a variety of UBM process needs
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Bump Plating Photoresists
Bump Plating Photoresists
DuPont offers positive- and negative-tone photoresists designed to meet the tight pitches and varied topographies of today’s semiconductor advanced packaging applications.
DuPont offers liquid bump plating photoresists, along with associated ancillaries, that are ideally suited for wafer-level packaging applications using single-spin coating. -
Through Silicon Via Copper
Through Silicon Via Copper
Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.
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Packaging Dielectrics
Packaging Dielectrics
Look to DuPont for packaging dielectric formulations that have the mechanical properties, high resolution, low-temp curing, easy processes, and superior reliability needed to protect your advanced WLP.
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