DuPont Electronics and Industrial offers a wide range of thermal management solutions for various industries, including electronics, automotive, aerospace, and industrial. These solutions include thermal interface materials, such as thermal pastes, adhesives, and pads, as well as phase change materials, heat sinks, and graphite sheets. These products help to manage heat dissipation, improve thermal conductivity, and enhance the performance and reliability of electronic devices and other applications that require efficient heat management.
Temprion ®
Temprion ® is a line of thermal management materials that includes thermal interface materials, thermal conductive tapes, and gap fillers. These materials provide exceptional thermal conductivity, high reliability, and superior mechanical properties, making them ideal for use in various applications that require efficient heat management, including electronics, automotive, aerospace, and industrial.
Kapton ®
Kapton ® is a polyimide film that offers excellent thermal stability, high-temperature resistance, and superior mechanical properties, making it an ideal material for use in various thermal management applications. It is commonly used as an insulating material in electronic devices and as a substrate for flexible printed circuits, where it helps to manage heat dissipation and improve overall performance and reliability.
Laird™
Laird ™ offers a wide range of thermal management solutions for various industries, including electronics, telecommunications, automotive, and industrial. These solutions include thermal interface materials like thermal pads, dispensable, high performance phase change and grease. Other innovative multifunctional products that manage heat dissipation, reduce EMI, and enhance the performance and reliability of electronic devices and other applications.
Applications
Ranging from electronic materials, automotive, construction, packaging, to industrial materials.
5G Wireless Technology
We support 5G Wireless Technology through our Laird Performance Materials’ advanced thermal and EMI solutions, including integrated solutions to help telecom engineers address their thermal and EMI challenges.
Electronics
The drive toward miniaturization in the consumer electronics and telecom sectors requires PCBs with higher circuit density, which puts greater demands on the metal and dielectric layers as line widths and spacings decrease. Choosing the right materials improves yield and controls manufacturing costs.
Industrial
We bring our materials science expertise to all aspects of component finishing, ensuring the reliable performance of electronic components and systems. We understand the demands of your end market regarding reliability, throughput, and cost.
High Heat
For applications where extremes of heat and vibration are the norm, designers rely on Kapton® because of its ability to maintain its unique combination of mechanical properties in the harshest of conditions.
Next-Gen Automotive
Our products improve the performance of everything from electrified powertrain to innovative electronics modules to cabin comfort components, ensuring high signal integrity and successful power transmission from bumper-to-bumper.
Sealing Lubricants
Our full line of Molykote® Specialty Lubricant products ensures we have a solution to solve your toughest challenges in nearly every situation.
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and solve the challenges of our time.